Abstract
A method for fabricating sub-micrometer size adhesion sites for future experiments in cell biology is presented. Glass substrates were coated with a thin layer of InSnO and SiO2. The SiO2 was structured by means of electron beam lithography and reactive ion etching, exposing sub-micrometer patches of the underlying InSnO. Dodecylphosphate, to which proteins can bind, was selectively adsorbed on these InSnO structures, whereas poly-l-lysine-g-poly(ethylene glycol) was used to passivate the surrounding SiO2 against protein adsorption. The effectiveness of the process was investigated by fluorescent microscopy and scanning near-field optical microscopy on substrates which have been exposed to fluorescently labeled streptavidin.
Original language | English (US) |
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Pages (from-to) | 582-586 |
Number of pages | 5 |
Journal | Microelectronic Engineering |
Volume | 78-79 |
Issue number | 1-4 |
DOIs | |
State | Published - Mar 2005 |
Event | Proceedings of the 30th International Conference on Micro- and Nano-Engineering - Duration: Sep 19 2004 → Sep 22 2004 |
Keywords
- Electron beam lithography
- Indium-tin-oxide
- Nanofabrication
- Protein adsorption
- Protein patterning
- Self-assembling
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering